From ExtremeTech: The semiconductor industry faces enormous challenges in virtually every field. Thanks to a recent advance in interconnect technology from Applied Materials, we should manage to squeeze a few more years out of the current CMOS process. Read the whole article
Read The Full Article:
http://cr4.globalspec.com/blogentry/20494/Threading-the-Nanoscale-Needle-Applied-
Materials-Launches-New-Interconnect-Technology?from_rss=1
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